Short for
Shrink Small Outline Package, it's a surface-mount
memory
packaging from
Intel. Key features of the SSOP include the following:
JEDEC standard
compliance, direction for Intel’s higher-density flash architectures, 0.8 mm
(31.5 mil) lead pitch offers handling characteristics similar to 50 mil pitch
packages, performance in wide temperature applications, and a two-sided and gull
wing lead package design. Intel's SSOP is JEDEC standard.
See also Small Outline Package.