SOP Last modified: Wednesday, December 21, 2005
Short for Small Outline Package, it's a low-profile rectangular surface-mount component package. Its chip is bonded to an inner land contact area (usually a lead frame). External terminals exit parallel to the seating plane on two opposite sides of the moulded, flat package. SOPs use gull wing formed leads, and is a surface mount package with a fixed lead pitch of .050".
•E-mail this definition to a colleague• For internet.com pages about SOP . Also check out the following links! DigChip  DigChip.com is a leading provider of electronic components documentation. We offer a reliable tool to find semiconductors components technical information: parts, datasheets, cross reference, obsolete and new circuits. Intel Small Outline Package Guide (PDF)  The Plastic Small Outline Package (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface-mount memory packaging from Intel. These Small Outline Packages give users strong packaging choices for all types of applications. In addition they support the widest range of nonvolatile memory component densities and features for the user’s applications. Intel Pentium Processor - Packing Identification Codes The following is a list of all the different package types that are currently being used on all Intel products. The package types are the prefixes for all of the ordering codes. These order codes are for the commercial components only. Intersil packaging Information Includes information on specific types of Plastic, heretic, and Elantec packages.	Hardware Integrated Circuits (ICs) Memory 90 nanometer chip controller fab integrated circuit PSOP semiconductor SSOP TSOP Give Us Your Feedback Shopping SOP Products Compare Products,Prices and Stores Shop by Category: Musical Instruments 1 Store Offers Toys 1 Store Offers Tools and Accessories 0 Store Offers Home Furnishings 91 Store Offers Personal Care 1 Store Offers