Short for
Plastic Small Outline Package, it's a surface-mount memory
packaging from
Intel. key features of the PSOP include the following:
JEDEC standard compliance,
footprint and height 50 percent of
DIP, two-side leaded for routing simplicity, 50 mil
(1.27 mm) pitch for SMT simplicity and ease of use, gull wing formed leads, and
it supports future flash density and feature growth. Intel's PSOP is JEDEC
standard.
See also Small Outline Package.
